A problem occured while loading the plugin: SimplePie Plugin for Textpattern -> : Non-static method SimplePie_Misc::parse_date() should not be called statically on line 60
A problem occured while loading the plugin: SimplePie Plugin for Textpattern -> : Non-static method SimplePie_Parse_Date::get() should not be called statically on line 10197
Thomas West Inc.

Buff CMP

TWI buff pads clean and help minimize defects in CMP

A buff polish step follows a primary polish with a hard pad in copper, tungsten and oxide CMP. A soft pad in the buff step helps reduce surface defects including slurry and scratches.

Perfecting Results

Embossed pattern reduces stiction in buff CMP
Embossed pattern reduces stiction in buff CMP

Recommended Pad: BP-24, BP-24E Embossed Black Poromeric

TWI BP-24E buff pads are currently trusted to refine the results of previous CMP process results.

TWI BP-24E buff pads perform as well as competitive products and, in some cases, better.

For more detailed information, contact buffCMP@ThomasWest.com