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Thomas West Inc.

Copper CMP

TWI's 312 pad is the newest in the CMP line

Second to tungsten, copper is increasingly used as interconnect material in semiconductor manufacturing. Copper process optimization involves minimal dishing and scratching.

More Predictability, Fewer Defects

Copper is integral to interconnect damascene structures
Copper is integral to interconnect damascene structures

Recommended Pad: 312

TWI improved its polyurethane/polyester fiber composite material to create the 312 pad for copper CMP.

The 312 pad lowers process costs by lasting longer, performing more predictably and consistently, and planarizing better (fewer defects.)

For more detailed information, contact copperCMP@Thomaswest.com